Copper
About Copper

Copper is a soft, ductile, and highly conductive metal that has been used by human societies since antiquity. Gold and meteoric iron were the only metals in common use prior to copper’s discovery circa 9000 BCE. This early use was facilitated by the existence of native copper deposits, which could be worked cold due to the softness of the metal. However, native copper is not particularly common, and eventually the process smelting of copper from ore was developed, which in turn led to the accidental discovery of alloying.
Adding another metal to copper increases its hardness and makes it easier to cast, making the metal considerably more useful. This occurred initially through the smelting of copper ores that contained small amounts of other metals, often arsenic and silicon, to produce a natural bronze. Later, it was discovered that bronze could be produced intentionally by adding tin to copper melt. This advance occurred between 4500 BCE and 600 BCE in different regions of the world. Bronze production is now recognized to be such a key technological achievement that the period in any society between this discovery and the development of iron smelting is often referred to as the “Bronze Age”.
The introduction of bronze allowed for the protection of harder, more durable metal tools and weapons. Bronze was so essential to civilizations of this period that history was shaped by the trade of the relatively rare tin ore necessary for its production. Though copper was easier to come by, its sources were also significant to ancient societies, and in fact lead to the naming of the element. In the Roman empire, copper was most often mined on the island of Cyprus, and the modern name of the metal is derived from the latin cuprum, which itself was derived from cyprium, meaning “metal of Cyprus”.
Though for many uses, alloys have preferable properties to pure copper metal, architecture has made use of elemental copper since ancient times. The patina that the metal develops over time provides a natural coating that makes it extremely durable and low-maintenance, and its malleability lends it to being molded into desired shapes. Today, copper in architecture is most often seen in roofing, flashings, rain gutters, and downspouts.
Metals other than tin came into use for alloying with copper later in history, especially nickel and zinc. Brass, an alloy of zinc and copper, is more malleable than either individual metal, easier to cast and has excellent acoustic properties. Initially, brass was used in coins and for decorative purposes, while today it is used extensively in brass musical instruments, for plumbing and electrical applications, and in applications such as lock where low metal-on-metal friction is required. Cupronickel alloys, including ancient Chinese paktong and european nickel silver or German silver, were initially used in a variety of applications, and still find use in the production of coins, plumbing fixtures, and musical instruments. Copper is also found in some gold alloys and in sterling silver.
In addition to using copper and its alloys widely for tools, instruments, currency, and building materials, ancient societies took advantage of copper for its antimicrobial properties. Though the ancient Egyptians did not understand that the copper was preventing the growth of microscopic organisms, they did recognized that water stored in copper vessels went foul less frequently, and that wounds dressed with copper tended to heal better. Today copper is still used in this capacity in a variety of settings, most notably hospitals, where coatings of copper on frequently-touched surfaces helps to limit the spread of disease-causing organisms.
Current applications for copper make frequent use of one of its properties that was not of particular interest for most of our history: electrical conductivity. Copper can be easily drawn into wires, and is the preferred electrical conductor for most wiring applications--roughly half of all copper mined is used in this way. In addition to being highly conductive, copper has high tensile strength, low thermal expansion, and resists corrosion and creep, properties which together result in reliable circuitry. The high conductivity of copper also enhances the energy efficiency of electric motors. Copper is likewise found in electronic devices such as electromagnets, vacuum tubes, magnetrons, and microwaves. Heat sinks and heat exchangers in electronic devices also sometimes use copper, as it dissipates heat more quickly than the most common alternative, aluminum.
Copper compounds also have many notable uses. Copper oxides and carbonates are used in pigments and glassmaking, and copper sulfate can be used as an herbicide, fungicide, and pesticide, as well as a chemical reagent in organic synthesis. Several copper compounds are semiconductors, including copper (I) oxide, one of the materials in which many semiconductor applications were first investigated. Today, copper semiconductors mostly find use in thin film solar cells. Copper can also be a component of high-temperature superconductors, and copper is used frequently in organic synthesis as a catalyst.
Naturally-occurring metallic copper has at times played a significant role in commercial supply of the metal, but most copper is found in sulfide, carbonate, and oxide minerals. Copper sulfides are the major copper ore, and after separation from iron and other unwanted material, these are roasted to produce the oxide. Copper oxide is then converted to blister copper through heating, and further purified through electrorefining. Copper is also recyclable without any loss in quality, and is the third most recycled metal after iron and aluminum.
Products
Featured High Purity Products
Compounds
- Ammonium Cupric Chloride
- Ammonium Cupric Sulfate Hexahydrate
- Ammonium Tetrachlorocuprate(II) Dihydrate
- Barium Calcium Titanate
- Bismuth Lead Strontium Calcium Copper Oxide
- Bismuth Strontium Calcium Copper Oxide
- Copper Aluminum Zinc Oxide
- Calcium Copper Titanate
- Carulite (MnO2/CuO) Catalyst
- Copper(I) Acetate
- Copper(II) Acetate
- Copper(II) Acetate Hydrate
- Copper(II) Acetate Monohydrate
- Copper Acetate Solution
- Copper Antimony Sulfide
- Copper Arsenate
- Copper(II) Borate
- Copper Benzoate
- Copper(I) Bromide CuBr
- Copper(II) Bromide CuBr2
- Copper Carbide
- Copper Carbonate
- Copper(II) Carbonate Basic
- Copper Chlorate
- Copper(I) Chloride CuCl
- Copper(I) Chloride - bis(lithium chloride) Complex
- Copper(I) Chloride Solution
- Copper(I) Chloride, Ultra Dry
- Copper(II) Chloride CuCl2
- Copper(II) Chloride Dihydrate
- Copper Chromate
- Copper Chromite
- Copper Chromite, Barium Promoted
- Copper(I) Cyanide
- Copper(I) Cyanide Di(lithium Chloride) Complex Solution
- Copper-doped Titanium Aluminum Carbide
- Copper Ferrite
- Copper Fluoride
- Copper(I) Hydride
- Copper Hydride Solution
- Copper Hydroxide
- Copper Hydroxide Phosphate
- Copper Hydroxyfluoride
- Copper Iodate
- Copper Iodide/Cesium Carbonate Admixture
- Copper Iodide
- Copper Iron Sulfide
- Copper Manganese Oxide
- Copper Molybdate
- Copper(II) Niobate
- Copper Nitrate/Ammonium Chloride
- Copper(II) Nitrate, Anhydrous
- Copper(II) Nitrate Hydrate
- Copper(II) Nitrate Hemi(pentahydrate)
- Copper(II) Nitrate Hexahydrate
- Copper Nitrate Solution
- Copper(II) Nitrate Trihydrate
- Copper Nitride
- Copper Oxalate
- Copper(II) Oxide CuO
- Copper(I) Oxide Cu2O
- Copper Oxychloride
- Copper Perchlorate Hexahydrate
- Copper Phosphate
- Copper Pyrophosphate
- Copper(II) Pyrophosphate Hydrate
- Copper Selenate
- Copper(II) Selenite Dihydrate
- Copper Selenite
- Copper Silicide
- Copper Stannate
- Copper(II) Stearate
- Copper Sulfate
- Copper Sulfate Basic
- Copper Sulfate Monohydrate
- Copper Sulfate Pentahydrate
- Copper Sulfate Solution
- Copper Tellurite
- Copper(II) Tetrafluoroborate
- Copper(II) Tetrafluoroborate Hexahydrate
- Copper(II) Tetrafluoroborate Hydrate
- Copper(I) Tetraiodomercurate
- Copper Tetraammine Sulfate Hydrate
- Copper(I) Thiocyanate
- Copper Titanate
- Copper(II) Trifluoroacetate Hydrate
- Copper Tungstate
- Copper(II) Vanadium Oxide
- Cupric Sulfate Anhydrous
- Copper Zirconate
- Erbium Barium Copper Oxide
- Europium Barium Copper Oxide
- Lanthanum Strontium Copper Oxide
- Lithium Tetrachlorocuprate
- Neodymium Barium Copper Oxide
- Potassium Copper(I) Cyanide
- Praseodymium Barium Copper Oxide
- Samarium Barium Copper Oxide
- Tetraamminecopper(II) Sulfate Monohydrate
- Yttrium Barium Copper Oxide
Metallic Forms
- Copper Balls
- Copper Bands
- Copper Bars
- Copper Beads
- Copper Block
- Copper Busbars
- Copper Cathode Plates
- Copper Cathode Squares
- Copper Cathodes
- Copper Chunk
- Copper Coil
- Copper Conductor Paste
- Copper Concentrate
- Copper Crucibles
- Copper Cubes
- Copper Cuttings
- Copper Cylinder
- Copper Disc
- Copper Electrode
- Tungsten-Copper Electrodes
- Copper Flake
- Copper Flanges
- Copper Foam
- Copper Foil
- Copper Gauze
- Copper Granules
- Copper Honeycomb
- Copper Ingot
- Copper Ink
- Copper Insulated Wire
- Copper Inquarts
- Copper Lump
- Copper Mesh
- Copper Metal
- Copper Microfoil
- Copper Particles
- Copper Parts
- Copper Pellets
- Copper Pieces
- Copper Plates
- Copper Powder
- Copper Puck
- Copper Punchings
- Copper Ribbon
- Copper Rings
- Copper Rod
- Copper Samples
- Copper Shaving
- Copper Sheets
- Copper Shot
- Copper Single Crystal
- Copper Sleeves
- Copper Slugs
- Copper Specimens
- Copper Spheres
- Copper Sponge
- Copper Spring
- Copper Strip
- Copper Tape
- Copper Tube
- Copper Turnings
- Copper Wafer
- Copper Wire
- Copper Wool
- Silver-Coated Copper Ink
- Silver Coated Copper Powder
- Ultra Thin Copper Foil
Alloys
- 2219 Aluminum Alloy Powder
- AlCuFe Quasicrystal
- Aluminum 4032 Alloy
- Aluminum Bronze Alloy C95400
- Aluminum Copper Alloy
- Aluminum Copper Lithium Alloy
- Aluminum Copper Magnesium Alloy
- Aluminum Copper Magnesium Manganese Alloy
- Aluminum Copper Manganese Silicon Magnesium Alloy
- Aluminum Copper Silicon Alloy
- Aluminum Copper Tungsten Alloy
- Aluminum Copper Tungsten Foil
- Aluminum Magnesium Copper Alloy
- Aluminum Magnesium Silicon Copper Alloy
- Aluminum Manganese Copper Alloy
- Aluminum Nickel Copper Magnesium Alloy
- Aluminium Tin Copper Alloy Particles
- Aluminum Tin Copper Alloy Powder
- Aluminum Zinc Magnesium Copper Chromium Alloy
- Arnd's Alloy
- Beryllium Copper Alloy
- Beryllium Copper Grids
- Brass Electrodes
- Bronze Electrodes
- Cerium Copper Alloy
- Cerium Copper Foil
- Chromium Copper Alloy
- Chromium Nickel Copper Alloy
- Copper Aluminum Foam
- Copper Aluminum Honeycomb
- Copper Aluminum Sponge
- Copper Aluminum Wool
- Copper Aluminum Zinc Alloy
- Copper Barium Alloy Particles
- Copper Barium Alloy Powder
- Copper Beryllium Foil
- Copper Boron Alloy
- Copper Cadmium Alloy
- Copper Cadmium Tin Alloy
- Copper Chromium Alloy
- Copper Chromium Nickel Silicon Alloy
- Copper Chromium Zirconium Alloy
- Copper Chromium Zirconium Alloy Particles
- Copper Chromium Zirconium Alloy Powder
- Copper Clad Molybdenum
- Copper Cobalt Alloy
- Copper Cobalt Sulfide
- Copper Gadolinium Alloy
- Copper Gallium Alloy
- Copper Gallium Foil
- Copper Germanium Alloy
- Copper Germanium Foil
- Copper Gold Alloy
- Copper Gold Nickel Alloy
- Copper Indium Alloy
- Copper Indium Foil
- Copper Indium Gallium Alloy
- Copper Indium Gallium Foil
- Copper Iron Alloy
- Copper Iron Zinc Alloy
- Copper Lanthanum Alloy
- Copper Lanthanum Magnesium Alloy
- Copper Lead Alloy
- Copper Lead Graphite Alloy
- Copper Lead Titanium Alloy
- Copper Magnesium Alloy
- Copper Manganese Nickel Alloy
- Copper Manganese Nickel Alloy Particles
- Copper Manganese Nickel Alloy Powder
- Copper Manganese Nickel Foil
- Copper Manganese Nickel Rod
- Copper Manganese Nickel Wire
- Copper Nickel Alloy
- Copper Nickel Alloy Powder
- Copper Nickel Foil
- Copper Nickel Mesh
- Copper Nickel Silicon Alloy
- Copper Nickel Tin Alloy
- Copper Nickel Wire
- Copper Nickel Zinc Alloy
- Copper Phosphorus
- Copper Silicon Alloy
- Copper Silicon Tin Alloy
- Copper Silicon Titanium Alloy
- Copper Silver Alloy
- Copper Silver Inquarts
- Copper Tin Alloy Spherical Powder
- Copper Tin Silver Alloy
- Copper Tin Titanium Alloy
- Copper Titanium Tin Alloy Particles
- Copper Titanium Tin Alloy Powder
- Copper Yttrium Alloy Particles
- Copper Yttrium Alloy Powder
- Copper Zinc Alloy
- Copper Zinc Alloy Flakes
- Copper Zinc Alloy Particles
- Copper-Zinc Alloy Powder
- Copper Zinc Silver Alloy
- Copper Zinc Tin Alloy
- Copper Zirconium Alloy
- Copper Zirconium Alloy Pieces
- Copper Zirconium Alloy Powder
- Cupro Nickel Aluminum Alloy
- Gold Copper Alloy
- Gold Copper Nickel Alloy
- Gold Copper Palladium Alloy
- Gold Silver Copper Alloy
- Gold Silver Copper Alloy Particles
- Gold Silver Copper Alloy Powder
- Holmium Copper Alloy
- Iron Chromium Nickel Copper Alloy
- Iron Chromium Nickel Copper Titanium Niobium
- Iron Nickel Copper
- Lithium Copper Alloy
- Manganese Copper
- Manganese Silicon Copper Alloy
- Molybdenum Copper Heat Sinks
- Molybdenum Copper Alloy
- Molybdenum Copper Wafers
- Monel 400 Alloy
- Monel K500 Alloy
- Monel R405 Alloy
- Neutroloy Alloy
- Nickel Aluminum Bronze
- Nickel Copper Alloy
- Nickel Copper Foam
- Nickel Copper Honeycomb
- Nickel Copper Iron Manganese Powder
- Nickel Copper Iron Manganese Rod
- Nickel Copper Metal
- Nickel Copper Iron Alloy
- Nickel Copper Silicon Alloy
- Nickel Copper Sponge
- Nickel Copper Wool
- Nickel Zinc Copper Titanium Alloy
- Palladium Copper Alloy
- Palladium Copper Foil
- Palladium Copper Sputtering Target
- Phosphor Bronze
- Phosphor Bronze Powder
- Praseodymium Copper Alloy
- Silver Cadmium Zinc Copper Alloy Particles
- Silver Cadmium Zinc Copper Alloy Powder
- Silver Copper Alloy
- Silver Copper Alloy Particles
- Silver Copper Alloy Powder
- Silver/Copper Eutectic Brazing Paste
- Silver Copper Foil
- Silver Copper Indium Alloy
- Silver Copper Manganese Nickel Alloy
- Silver Copper Nickel Alloy
- Silver Copper Palladium Alloy
- Silver Copper Tin Alloy
- Silver Copper Tin Nickel Alloy
- Silver Copper Titanium Alloy
- Silver Copper Wire
- Silver Copper Zinc Alloy
- Silver Copper Zinc Manganese Nickel Alloy
- Silver Copper Zinc Nickel Alloy
- Silver Copper Zinc Tin Alloy
- Spangold Alloy
- Tellurium Copper Alloy
- Tin Bismuth Copper Silver Alloy
- Tin Copper Alloy
- Tinned Copper Foil
- Tinned Copper Wire
- Tin Indium Silver Bismuth Copper Alloy
- Tin Silver Bismuth Copper Alloy
- Tin Silver Copper Alloy
- Titanium Copper Alloy
- Titanium Nickel Copper Alloy
- Tungsten Carbide Copper Alloy
- Tungsten Copper Alloy
- Tungsten Copper Bar
- Tungsten Copper Foil
- Tungsten Copper Sheet
- Tungsten Copper Tube
- Tungsten Copper Wire
- Tungsten Nickel Copper Alloy
- Tungsten Nickel Copper Iron Alloy
- Vanadium Copper Alloy
- Vanadium Copper Foil
- Yttrium Copper Iron Alloy
- Yttrium Copper Molybdenum Alloy
- Zinc Copper Alloy
- Zinc Copper Titanium Alloy
- Zirconium Copper Alloy
- Zirconium Copper Aluminum Alloy
Oxide Forms
- Copper(I) Oxide Hollow Spheres
- Copper Oxide Nanoparticle Ink
- Copper Oxide Nanoparticles
- Copper(I) Oxide Nanospheres
- Copper Oxide Needles
- Copper Oxide Particles
- Copper Oxide Pellets
- Copper Oxide Pieces
- Copper Oxide Powder
- Copper Oxide Rotatable Sputtering Target
- Copper Oxide Shot
- Copper Oxide Sputtering Target
- Copper Oxide Tablets
- Copper Oxide/Aluminum Oxide Granules
- Copper Oxide/Indium Oxide Granules
- Copper(II) Oxide Wire
Organometallics
- 1,4,8,11,15,18,22,25-Octabutoxyphthalocyanine Copper Salt
- 1-Butanethiol Copper Salt
- 8-Hydroxyquinoline Copper Salt
- Bis(1,3-bis(2,6-diisopropylphenyl)imidazol-2-ylidene)copper Tetrafluoroborate
- Bis(1,4-diazabicyclo[2.2.2]octane)tetra(copper iodide)
- Bis(1-dimethylamino-2-methyl-2-butoxy)Copper(II)
- Bis(2,2,6,6-tetramethylheptane-3,5-dionato)copper
- Bis(8-quinolinolato)copper
- Bis(dimethylamino-2-propoxy)copper
- Bis(ethylenediamine)copper(II) Hydroxide Solution
- Bis(N,N'-dimethylpiperazine)tetra[copper iodide]
- Bis(N,N'-di-sec-butylacetamidinato)dicopper
- Bis[(tetrabutylammonium iodide)copper(I) Iodide]
- [Bis(trimethylsilyl)acetylene](hexafluoroacetylacetonato)copper
- Bis(triphenylphosphine)copper Borohydride
- Bis(triphenylphosphine)copper(I) Borohydride
- Bis(triphenylphosphine)copper(I) Nitrate
- Bis[1,3-bis(2,4,6-trimethylphenyl)imidazol-2-ylidene]copper Tetrafluoroborate
- Bromo(1,10-phenanthroline)(triphenylphosphine)copper(I)
- Bromo(1,10-phenanthroline)(triphenylphosphine)copper(I) Nitrate Dichloromethane Adduct
- Bromotris(triphenylphosphine)copper
- Chloro[1,3-bis(2,6-diisopropylphenyl)imidazol-2-ylidene]copper
- Chloro(1,3-dimesitylimidazol-2-ylidene)copper(I)
- Chloro(1,5-cyclooctadiene)copper(I) Dimer
- Chlorophyllin Sodium Copper Salt
- Copper 1,2,3,4,8,9,10,11,15,16,17,18,22,23,24,25-hexadecafluoro-29H,31H-phthalocyanine
- Copper 1,3-diphenyl-1,3-propanedionate
- Copper 2,3,9,10,16,17,23,24-octakis(octyloxy)-29H,31H-phthalocyanine
- Copper 2,3-naphthalocyanine
- Copper 2,9,16,23-tetra-tert-butyl-29H,31H-phthalocyanine
- Copper 2-Ethylhexanoate
- Copper 2-pyrazinecarboxylate
- Copper 3,10,17,24-tetra-tert-butyl-1,8,15,22-tetrakis(dimethylamino)-29H,31H-phthalocyanine
- Copper 3,5-diisopropylsalicylate Hydrate
- Copper 3-Methylsalicylate
- Copper 4,4',4'',4'''-tetraaza-29H,31H-phthalocyanine
- Copper 5,9,14,18,23,27,32,36-octabutoxy-2,3-naphthalocyanine
- Copper Acetylacetonate
- Copper Acrylate
- Copper Benzene-1,3,5-tricarboxylate
- Copper Beta Resorcylate, Monobasic
- Copper Bis(2-hydroxyethyl)dithiocarbamate
- Copper Bis(trifluoromethylsulfonyl)imide
- Copper Bromide Dimethyl Sulfide Complex
- Copper Butyrate
- Copper Caprylate
- Copper Citrate
- Copper Citrate Hemitrihydrate
- Copper Cyclohexanebutyrate
- Copper D-gluconate
- Copper Diethyldithiocarbamate
- Copper Dimethyldithiocarbamate
- Copper Diphenylphosphinate
- Copper Disalicylate
- Copper Disodium Ethylenediaminetetraacetate
- Copper Ethoxide
- Copper Ethylacetoacetate
- Copper Formate Hydrate
- Copper Formate Tetrahydrate
- Copper Glycinate
- Copper Heptafluorodimethyloctanedionate
- Copper Hexafluoroacetylacetonate 1,5-cyclooctadiene Complex
- Copper Hexafluoroacetylacetonate Hydrate
- Copper Iodide Dimethyl Sulfide Complex
- Copper Iodide Trimethylphosphite Complex
- Copper Methoxide
- Copper MOF-14
- Copper Naphthenate
- Copper Neodecanoate
- Copper Octaethylporphyrin
- Copper Octoate
- Copper Oleate
- Copper Peptonate
- Copper Phenylacetylide
- Copper Phthalocyanine
- Copper Phthalocyanine Green G
- Copper Phthalocyanine-3,4',4",4"'-tetrasulfonic Acid Tetrasodium Salt
- Copper Phthalocyanine-tetrasulfonic Acid Tetrasodium Salt
- Copper Salicylate
- Copper Salicylate Monobasic
- Copper Tetrakis(4-cumylphenoxy)phthalocyanine
- Copper Thiophene-2-carboxylate
- Copper TPP
- Copper Trifluoroacetylacetonate
- Copper Trifluoromethanesulfonate
- Copper Trifluoromethanesulfonate Benzene Complex
- Copper Trifluoromethanesulfonate Toluene Complex
- Copper Trifluoromethanesulfonimide Hydrate
- Copper Undecylenate
- Copper(I) Thiophenolate
- Copper(II) Hexafluoroacetylacetonate Hydrate
- Copper(II) Tartrate
- Copper(II) Tartrate Hydrate
- Cu(dap)2sub> Chloride
- Cuprolinic Blue
- Cu-TMEDA Catalyst
- Cyclopentadienyl(triethylphosphine)copper(I)
- Dibromo(1,10-phenanthroline)copper
- Diethylenetriamine-pentaacetic Acid Hemihydrate Copper Trisodium Salt
- Dinitrato(1,10-phenanthroline)copper
- (Ethylcyclopentadienyl)(triphenylphosphine)copper
- Ethylenediaminetetraacetic Acid Copper Disodium Salt
- Ethylenediaminetetraacetic Acid Diammonium Copper Salt Solution
- Fluorotris(triphenylphosphine)copper(I)
- (Hexamethylenetetramine)penta[copper cyanide]
- Indium Copper Diethylthiolatetriphenylphosphine Complex
- Iodo(triethyl phosphite)copper(IV)
- Iodo(trimethylphosphite)copper
- Lithium 2-thienylcyanocuprate Solution
- Mesitylcopper(I)
- (N,N'-Diisopropylacetamidinato)copper
- Poly(copper phthalocyanine)
- Potassium bis(oxalato)cuprate(II) Hydrate
- [(R,R)-1,5-Diaza-cis-decalin]copper Hydroxide Iodide Hydrate
- Tetraamminecopper Sulfate Monohydrate
- Tetrakis(acetonitrile)copper Hexafluorophosphate
- Tetrakis(acetonitrile)copper Tetrafluoroborate
- Tetrakis(pyridine)copper Triflate
- Tetrakisacetonitrile Copper(I) Triflate
- Trifluoromethyl(1,10-phenanthroline)copper
- Trifluoromethylthiolato(2,2-bipyridine)copper(I)
- (Triphenylphosphine)copper Hydride Hexamer
- Tris(triphenylphosphine)(trifluoromethyl)copper
Nanomaterials
- Copper Aluminum Oxide Nanoparticle Dispersion
- Copper Aluminum Oxide Nanoparticles
- Copper Carbon Nanotube
- Copper Indium Nanoparticles
- Copper Indium Gallium Nanoparticles
- Copper Indium Gallium Selenide Nanoparticles
- Copper Indium Selenide Nanoparticles
- Copper Indium Sulfide Nanoparticles
- Copper Iron Oxide Nanoparticle Dispersion
- Copper Iron Oxide Nanoparticles
- Copper Nanoparticles
- Copper Nanoparticle Dispersion
- Copper Nanorods
- Copper Nanotubes
- Copper Nanowires
- Copper Nanowire Dispersion
- Copper Nickel Nanoparticles
- Copper(II) Oxide Nanoparticle Dispersion
- Copper Oxide Nanoparticle Ink
- Copper Oxide Nanoparticles
- Copper Oxide Nanospheres
- Copper Silicate Nanoparticles
- Copper Tin Alloy Nanoparticles
- Copper Zinc Alloy Nanoparticles
- Copper Zinc Alloy Nanoprisms
- Copper Zinc Iron Oxide Nanoparticle Dispersion
- Copper Zinc Iron Oxide Nanoparticles
- Copper Zinc Nanoparticle Dispersion
- Iron Nickel Copper Nanoparticles
- Silver Copper Nanopowder
- ZnCuInS/ZnS Quantum Dots
Semiconductor & Optical
- CIGS Granule
- CIS Granules
- CIGS Lump
- CIGS Particles
- CIGS Powder
- CIGS Single Crystal
- CIGSS Granule
- CIGSS Lump
- CIGSS Powder
- CIS Particles
- CIS Powder
- CIS Single Crystal
- Copper Aluminum Selenide
- Copper Aluminum Sulfide
- Copper Antimonide
- Copper Arsenide
- Copper Gallium Oxide
- Copper Gallium Selenide
- Copper Gallium Telluride
- Copper Germanium Selenide
- Copper Indium Gallium Selenide
- Copper Indium Selenide
- Copper Indium Selenide Granule
- Copper Indium Telluride Granules
- Copper Lanthanum Sulfide
- Copper Phosphide
- Copper(I) Selenide Cu2Se
- Copper(II) Selenide CuSe
- Copper(I) Sulfide
- Copper Sulfide
- Copper Sulfide, Ultra Dry
- Copper(I) Telluride Cu2Te
- Copper(II) Telluride CuTe
- Copper Titanium Selenide Granules
- Copper Titanium Telluride Granules
- Copper Zinc Tin Selenide
- Copper Zinc Tin Sulfide
- CuBi3PbS6 Crystal
- CuCrP2S6 Crystal
- CuFeTe Crystal
- CuIn7Se11 Crystal
- CuInP2S6 Crystal
- CuInP2Se6 Crystal
- Cu2Se3 Crystal
- Si2CuP3 Crystal
- ZnS:Cu,Al Phosphor
Sputtering Targets
- Aluminum Copper Magnesium Chromium Zinc Sputtering Target
- Aluminum Copper Manganese Magnesium Sputtering Target
- Aluminum Copper Manganese Magnesium Rotatable Sputtering Target
- Aluminum Copper Manganese Sputtering Target
- Aluminum Copper Manganese Rotatable Sputtering Target
- Aluminum Copper Magnesium Chromium Zinc Rotatable Sputtering Target
- Aluminum Copper Molybdenum Rotatable Sputtering Target
- Aluminum Copper Silicon Sputtering Target
- Aluminum Copper Sputtering Target
- Aluminum Copper Tungsten Sputtering Target
- Aluminum Magnesium Copper Sputtering Target
- Aluminum Magnesium Copper Nickel Sputtering Target
- Aluminum Magnesium Copper Nickel Rotatable Sputtering Target
- Aluminum Niobium Tantalum Sputtering Target
- Aluminum Silicon Copper Magnesium Chromium Rotatable Sputtering Target
- Aluminum Silicon Copper Magnesium Chromium Sputtering Target
- Aluminum Silicon Copper Manganese Magnesium Rotatable Sputtering Target
- Aluminum Silicon Copper Manganese Magnesium Sputtering Target
- Aluminum Silicon Copper Sputtering Target
- Beryllium-Copper Alloy Sputtering Target
- Cerium Copper Sputtering Target
- Chromium Copper Sputtering Target
- CIGS Sputtering Target
- CIGSS Sputtering Target
- Copper Aluminum Oxide Sputtering Target
- Copper Aluminum Sputtering Target
- Copper Aluminum Sulfide Sputtering Target
- Copper Antimony Selenide Sputtering Target
- Copper Bismuth Alloy Sputtering Target
- Copper Chrome Sputtering Target
- Copper Chromium Zirconium Alloy Sputtering Target
- Copper Cobalt Sputtering Target
- Copper Fluoride Sputtering Target
- Copper Gallium Oxide Sputtering Target
- Copper Gallium Selenide Sputtering Target
- Copper Gallium Sputtering Target
- Copper Germanium Sputtering Target
- Copper-Indium-Gallium Sputtering Target
- Copper Indium Selenide Sputtering Target
- Copper Indium Sputtering Target
- Copper Indium Sulfide Sputtering Target
- Copper Iodide Sputtering Target
- Copper Iridium Oxide Sputtering Target
- Copper Iron Alloy Sputtering Target
- Copper Iron Sulfide Sputtering Target
- Copper Iron Zinc Alloy Sputtering Target
- Copper Lanthanum Magnesium Alloy Sputtering Target
- Copper-Lead Alloy Sputtering Target
- Copper-Lead-Graphite Alloy Sputtering Target
- Copper Lead Titanium Alloy Sputtering Target
- Copper Manganese Nickel Alloy Sputtering Target
- Copper Molybdate Sputtering Target
- Copper Nickel Sputtering Target
- Copper Nickel Silicon Alloy Sputtering Target
- Copper Nickel Tin Alloy Sputtering Target
- Copper Nickel Zinc Alloy Sputtering Target
- Copper Osmium Sputtering Target
- Copper(II) Oxide Sputtering Target
- Copper(II) Oxide Rotatable Sputtering Target
- Copper Oxide/Tin Oxide Sputtering Target
- Copper Phosphide Sputtering Target
- Copper Rotatable Sputtering Target
- Copper(I) Selenide Sputtering Target
- Copper Sputtering Target
- Copper(II) Sulfide Sputtering Target
- Copper(II) Telluride Sputtering Target
- Copper Zinc Sputtering Target
- Copper Zinc Tin Sputtering Target
- Gadolinium Barium Copper Oxide Sputtering Target
- Germanium Copper Telluride Sputtering Target
- Gold Copper Sputtering Target
- Holmium Barium Copper Oxide Sputtering Target
- Holmium Copper Sputtering Target
- Lanthanum Copper Manganate Sputtering Target
- Lanthanum Copper Oxide Sputtering Target
- Lithium Copper Oxide Sputtering Target
- Lanthanum Strontium Copper Oxide Sputtering Target
- Manganese Copper Sputtering Target
- Molybdenum Copper Alloy Sputtering Target
- Neodymium Copper Oxide Sputtering Target
- Nickel Copper Sputtering Target
- Praseodymium Barium Copper Oxide Sputtering Target
- Samarium Barium Copper Oxide Sputtering Target
- Samarium Cerium Copper Oxide Sputtering Target
- Samarium Copper Oxide Sputtering Target
- Silver Copper Sputtering Target
- Strontium Copper Oxide Sputtering Target
- Tungsten Copper Alloy Sputtering Target
- Vanadium Copper Sputtering Target
- Yttrium Barium Cuprate Sputtering Target
- Zirconium Copper Sputtering Target
Isotopes
Copper is used as a building material, a conductor of heat and electricity, and as a component of various metal alloys. Due to its high electrical conductivity, large amounts of copper are used by the electrical industry for wire. Since copper is resistant to corrosion caused by moisture, it is widely used in pipes, coins, and jewelry. Copper is too soft to be used alone in most applications, so it is instead incorporated in numerous alloys. For example, brass is a copper-zinc alloy, and bronze is a copper-tin alloy. Copper compounds have wide-ranging industrial applications. Copper sulfate (CuSO4· H2O), also known as blue vitrol, is the most well-known copper compound, used as an agricultural fungicide, an algicide, and as a pigment for inks. Cuprous chloride (CuCl) is a powder used to absorb carbon dioxide (CO2). Copper cyanide (CuCN) is often used in electroplating applications.
Copper is available as metallic and compound forms with purities from 99% to 99.999% (ACS grade to ultra-high purity). Elemental or metallic forms include pellets, rod, wire and granules for evaporation source material purposes. Copper nanoparticles and nanopowders are also available. Oxides are available in powder and dense pellet form for such uses as optical coating and thin film applications. Oxides tend to be insoluble. Fluorides are another insoluble form for uses in which oxygen is undesirable such as metallurgy, chemical and physical vapor deposition and in some optical coatings. Copper is also available in soluble forms including chlorides, nitrates and acetates. These compounds can be manufactured as solutions at specified stoichiometries.
Copper Properties
Copper is a Block D, Group 11, Period 4 element. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar] 3d10 4s1.
The copper atom has a radius of 127.8 .pm and its Van der Waals radius is 140.pm. In its elemental form, CAS 7440-50-8, copper has a red-orange metallic luster appearance. Of all pure metals, only silver has a higher electrical conductivity. Copper was first discovered by Early Man. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus". Cyprus, a Mediterranean island, was known as an ancient source of mined copper.
General Properties
Symbol: | Cu |
---|---|
Atomic Number: | 29 |
Atomic Weight: | 63.546 |
Element Category: | transition metal |
Group, Period, Block: | 11, 4, d |
Color: | orange-red |
Other Names: | Cuprum, Cuivre, Kupfer, Cobre |
Physical Properties
Melting Point: | 1083.0 °C, 1981.4 °F, 1356.15 K |
---|---|
Boiling Point: | 2567.0 °C, 4652.6 °F, 2840.15 K |
Density: | 8.96 g/cm3 |
Liquid Density @ Melting Point: | 8.02 g·cm3 |
Density @ 20°C: | 8.96 g/cm3 |
Density of Solid: | 8920 kg·m3 |
Specific Heat: | 0.092 Cal/g/K @ 25°C |
Superconductivity Temperature: | N/A |
Triple Point: | N/A |
Critical Point: | N/A |
Heat of Fusion (kJ·mol-1): | 13 |
Heat of Vaporization (kJ·mol-1): | 306.7 |
Heat of Atomization (kJ·mol-1): | 337.15 |
Thermal Conductivity: | 401 W·m-1·K-1 |
Thermal Expansion: | (25 °C) 16.5 µm·m-1·K-1 |
Electrical Resistivity: | 1.678 µΩ·cm @ 20°C |
Tensile Strength: | N/A |
Molar Heat Capacity: | 24.440 J·mol-1·K-1 |
Young's Modulus: | 110–128 GPa |
Shear Modulus: | 48 GPa |
Bulk Modulus: | 140 GPa |
Poisson Ratio: | 0.34 |
Mohs Hardness: | 3 |
Vickers Hardness: | 369 MPa |
Brinell Hardness: | 35 HB = 874 MPa |
Speed of Sound: | (r.t.) (annealed) 3810 m·s,-1 |
Pauling Electronegativity: | 1.9 |
Sanderson Electronegativity: | 1.98 |
Allred Rochow Electronegativity: | 1.75 |
Mulliken-Jaffe Electronegativity: | 1.49 (s orbital) |
Allen Electronegativity: | N/A |
Pauling Electropositivity: | 2.1 |
Reflectivity (%): | 90 |
Refractive Index: | N/A |
Chemical Properties
Electrons: | 29 |
---|---|
Protons: | 29 |
Neutrons: | 35 |
Electron Configuration: | [Ar] 3d10 4s1 |
Atomic Radius: | 128 pm |
Atomic Radius, non-bonded (Å): | 1.96 |
Covalent Radius: | 132±4 pm |
Covalent Radius (Å): | 1.22 |
Van der Waals Radius: | 140 pm |
Oxidation States: | -2, +1, +2, +3, +4 (mildly basic oxide) |
Phase: | Solid |
Crystal Structure: | Cubic |
Magnetic Ordering: | diamagnetic |
Electron Affinity (kJ·mol-1) | 119.117 |
1st Ionization Energy: | 745.49 kJ·mol-1 |
2nd Ionization Energy: | 1957.93 kJ·mol-1 |
3rd Ionization Energy: | 3554.64 kJ·mol-1 |
Identifiers
CAS Number: | 7440-50-8 |
---|---|
EC Number: | 231-159-6 |
MDL Number: | MFCD00010965 |
Beilstein Number: | N/A |
SMILES Identifier: | [Cu] |
InChI Identifier: | InChI=1S/Cu |
InChI Key: | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
PubChem CID: | 23978 |
ChemSpider ID: | 22414 |
Abundance
Earth - Total: | 31 ppm |
---|---|
Mercury - Total: | 5.1 ppm |
Venus - Total: | 35 ppm |
Earth - Seawater (Oceans), ppb by weight: | 3 |
Earth - Seawater (Oceans), ppb by atoms: | 0.29 |
Earth - Crust (Crustal Rocks), ppb by weight: | 68000 |
Earth - Crust (Crustal Rocks), ppb by atoms: | 22000 |
Sun - Total, ppb by weight: | 700 |
Sun - Total, ppb by atoms: | 10 |
Stream, ppb by weight: | 6 |
Stream, ppb by atoms: | 0.09 |
Meterorite (Carbonaceous), ppb by weight: | 110000 |
Meterorite (Carbonaceous), ppb by atoms: | 31000 |
Typical Human Body, ppb by weight: | 1000 |
Typical Human Body, ppb by atom: | 99 |
Universe, ppb by weight: | 60 |
Universe, ppb by atom: | 1 |
History
Discovered By: | N/A |
---|---|
Discovery Date: | Around 9000 BC |
First Isolation: | N/A |
Health, Safety & Transportation Information for Copper
Copper is an essential trace element in animals and plants, but in excess copper is toxic. Safety data for Copper and its compounds can vary widely depending on the form. For potential hazard information, toxicity, and road, sea and air transportation limitations, such as DOT Hazard Class, DOT Number, EU Number, NFPA Health rating and RTECS Class, please see the specific material or compound referenced in the Products tab. The below information applies to elemental (metallic) Copper.
Safety Data | |
---|---|
Signal Word | Danger |
Hazard Statements | H228-H400 |
Hazard Codes | F |
Risk Codes | 11 |
Safety Precautions | 16 |
RTECS Number | GL5325000 |
Transport Information | UN 3089 4.1/PG 2 |
WGK Germany | 3 |
Globally Harmonized System of Classification and Labelling (GHS) | ![]() ![]() |
Review and Print SDS for Copper Metal
SAFETY DATA SHEET
SECTION 1. IDENTIFICATION
Product Name: Copper Metal
Product Number: All applicable American Elements product codes, e.g. CU-M-02, CU-M-03, CU-M-04, CU-M-05, CU-M-06
CAS #: 7440-50-8
Relevant identified uses of the substance: Scientific research and development
Supplier details:
American Elements
1093 Broxton Ave. Suite 2000
Los Angeles, CA 90024
Tel: +1 310-208-0551
Fax: +1 310-208-0351
Emergency telephone number:
Domestic, North America +1 800-424-9300
International +1 703-527-3887
SECTION 2. HAZARDS IDENTIFICATION
Classification of the substance or mixture
Classification according to Regulation (EC) No 1272/2008
The substance is not classified as hazardous to health or the environment according to the CLP regulation.
Classification according to Directive 67/548/EEC or Directive 1999/45/EC
Not applicable
Information concerning particular hazards for human and environment:
No information known.
Hazards not otherwise classified
No information known.
Label elements
Labelling according to Regulation (EC) No 1272/2008
Not applicable
Hazard pictograms
Not applicable
Signal word
Not applicable
Hazard statements
Not applicable
WHMIS classification
Not controlled
Classification system
HMIS ratings (scale 0-4)
(Hazardous Materials Identification System)
HEALTH
FIRE
REACTIVITY
0
0
0
Health (acute effects) = 0
Flammability = 0
Physical Hazard = 0
Other hazards
Results of PBT and vPvB assessment
PBT: Not applicable.
vPvB: Not applicable.
SECTION 3. COMPOSITION/INFORMATION ON INGREDIENTS
Chemical characterization: Substances
CAS# Description:
7440-50-8 Copper
Identification number(s):
EC number: 231-159-6
SECTION 4. FIRST AID MEASURES
Description of first aid measures
General information
No special measures required.
After inhalation
Seek medical treatment in case of complaints.
After skin contact
Generally the product does not irritate the skin.
After eye contact
Rinse opened eye for several minutes under running water. If symptoms persist, consult a doctor.
After swallowing
If symptoms persist consult doctor.
Information for doctor
Most important symptoms and effects, both acute and delayed
No further relevant information available.
Indication of any immediate medical attention and special treatment needed
No further relevant information available.
SECTION 5. FIREFIGHTING MEASURES
Extinguishing media
Suitable extinguishing agents
Special powder for metal fires. Do not use water.
For safety reasons unsuitable extinguishing agents
Water
Special hazards arising from the substance or mixture
If this product is involved in a fire, the following can be released:
Copper oxides
Advice for firefighters
Protective equipment:
No special measures required.
SECTION 6. ACCIDENTAL RELEASE MEASURES
Personal precautions, protective equipment and emergency procedures
Not required.
Environmental precautions:
Do not allow material to be released to the environment without proper governmental permits.
Do not allow product to reach sewage system or any water course.
Do not allow to penetrate the ground/soil.
Methods and material for containment and cleaning up:
Pick up mechanically.
Prevention of secondary hazards:
No special measures required.
Reference to other sections
See Section 7 for information on safe handling
See Section 8 for information on personal protection equipment.
See Section 13 for disposal information.
SECTION 7. HANDLING AND STORAGE
Handling
Precautions for safe handling
Keep container tightly sealed.
Store in cool, dry place in tightly closed containers.
Information about protection against explosions and fires:
No special measures required.
Conditions for safe storage, including any incompatibilities
Storage
Requirements to be met by storerooms and receptacles:
No special requirements.
Information about storage in one common storage facility:
No information known.
Further information about storage conditions:
Keep container tightly sealed.
Store in cool, dry conditions in well sealed containers.
Specific end use(s)
No further relevant information available.
SECTION 8. EXPOSURE CONTROLS/PERSONAL PROTECTION
Additional information about design of technical systems:
No further data; see section 7.
Control parameters
Components with limit values that require monitoring at the workplace: 7440-50-8 Copper (100.0%)
PEL (USA) Long-term value: 1* 0.1** mg/m³ as Cu *dusts and mists **fume
REL (USA) Long-term value: 1* 0.1** mg/m³ as Cu *dusts and mists **fume
TLV (USA) Long-term value: 1* 0.2** mg/m³ *dusts and mists; **fume; as Cu
EL (Canada) Long-term value: 1* 0.2** mg/m³ *dusts and mists; **fume
EV (Canada) Long-term value: 0.2* 1** mg/m³ as copper, *fume;**dust and mists
Additional information: No data
Exposure controls
Personal protective equipment
General protective and hygienic measures
The usual precautionary measures for handling chemicals should be followed.
Maintain an ergonomically appropriate working environment.
Breathing equipment: Not required.
Protection of hands: Not required.
Penetration time of glove material (in minutes)
Not determined
Eye protection: Safety glasses
Body protection: Protective work clothing.
SECTION 9. PHYSICAL AND CHEMICAL PROPERTIES
Information on basic physical and chemical properties
General Information
Appearance:
Form: Solid in various forms
Color: Copper colored
Odor: Odorless
Odor threshold: Not determined.
pH-value: Not applicable.
Change in condition
Melting point/Melting range: 1083 °C (1981 °F)
Boiling point/Boiling range: 2562 °C (4644 °F)
Sublimation temperature / start: Not determined
Flammability (solid, gaseous): Not determined.
Ignition temperature: Not determined
Decomposition temperature: Not determined
Auto igniting: Not determined.
Danger of explosion: Not determined.
Explosion limits:
Lower: Not determined
Upper: Not determined
Vapor pressure at 20 °C (68 °F): 0 hPa
Density at 20 °C (68 °F): 8.94 g/cm³ (74.604 lbs/gal)
Relative density: Not determined.
Vapor density: Not applicable.
Evaporation rate: Not applicable.
Solubility in / Miscibility with Water: Insoluble
Partition coefficient (n-octanol/water): Not determined.
Viscosity:
dynamic: Not applicable.
kinematic: Not applicable.
Other information
No further relevant information available
SECTION 10. STABILITY AND REACTIVITY
Reactivity
No information known.
Chemical stability
Stable under recommended storage conditions
Thermal decomposition / conditions to be avoided:
Decomposition will not occur if used and stored according to specifications.
Possibility of hazardous reactions
No dangerous reactions known
Conditions to avoid
No further relevant information available.
Incompatible materials:
No information known.
Hazardous decomposition products:
Copper oxides
SECTION 11. TOXICOLOGICAL INFORMATION
Information on toxicological effects
Acute toxicity:
The Registry of Toxic Effects of Chemical Substances (RTECS) contains acute toxicity data for this substance.
LD/LC50 values that are relevant for classification:
Oral LD50 >5000 mg/kg (mouse)
Skin irritation or corrosion: No irritant effect.
Eye irritation or corrosion: No irritant effect.
Sensitization: No sensitizing effects known.
Germ cell mutagenicity: No effects known.
Carcinogenicity:
EPA-D: Not classifiable as to human carcinogenicity: inadequate human and animal evidence of carcinogenicity or no data are available.
The Registry of Toxic Effects of Chemical Substances (RTECS) contains tumorigenic and/or carc inogenic and/or neoplastic data for this substance.
Reproductive toxicity:
The Registry of Toxic Effects of Chemical Substances (RTECS) contains reproductive data for this substance.
Specific target organ system toxicity - repeated exposure: No effects known.
Specific target organ system toxicity - single exposure: No effects known.
Aspiration hazard: No effects known.
Subacute to chronic toxicity: No effects known.
Additional toxicological information:
To the best of our knowledge the acute and chronic toxicity of this substance is not fully known.
Carcinogenic categories
OSHA-Ca (Occupational Safety & Health Administration)
Substance is not listed.
SECTION 12. ECOLOGICAL INFORMATION
Toxicity
Aquatic toxicity:
No further relevant information available.
Persistence and degradability
No further relevant information available.
Bioaccumulative potential
No further relevant information available.
Mobility in soil
No further relevant information available.
Additional ecological information:
General notes:
Do not allow material to be released to the environment without proper governmental permits.
Do not allow undiluted product or large quantities to reach ground water, water course or sewage system.
Avoid transfer into the environment.
Results of PBT and vPvB assessment
PBT: Not applicable.
vPvB: Not applicable.
Other adverse effects
No further relevant information available.
SECTION 13. DISPOSAL CONSIDERATIONS
Waste treatment methods
Recommendation
Consult state, local or national regulations to ensure proper disposal.
Uncleaned packagings:
Recommendation:
Disposal must be made according to official regulations.
SECTION 14. TRANSPORT INFORMATION
UN-Number
DOT, ADN, IMDG, IATA
Not applicable
UN proper shipping name
DOT, ADN, IMDG, IATA
Not applicable
Transport hazard class(es)
DOT, ADR, ADN, IMDG, IATA
Class
Not applicable
Packing group
DOT, IMDG, IATA
Not applicable
Environmental hazards:
Marine pollutant (IMDG):
Yes (PP)
Yes (P)
Special precautions for user
Not applicable.
Transport in bulk according to Annex II of MARPOL73/78 and the IBC Code
Not applicable.
Transport/Additional information:
DOT
Marine Pollutant (DOT):
No
UN "Model Regulation":
-
SECTION 15. REGULATORY INFORMATION
Safety, health and environmental regulations/legislation specific for the substance or mixture
National regulations
All components of this product are listed in the U.S. Environmental Protection Agency Toxic Substances Control Act Chemical substance Inventory.
All components of this product are listed on the Canadian Domestic Substances List (DSL).
SARA Section 313 (specific toxic chemical listings)
7440-50-8 Copper
California Proposition 65
Prop 65 - Chemicals known to cause cancer
Substance is not listed.
Prop 65 - Developmental toxicity
Substance is not listed.
Prop 65 - Developmental toxicity, female
Substance is not listed.
Prop 65 - Developmental toxicity, male
Substance is not listed.
Information about limitation of use:
For use only by technically qualified individuals.
Other regulations, limitations and prohibitive regulations
Substance of Very High Concern (SVHC) according to the REACH Regulations (EC) No. 1907/2006.
Substance is not listed.
The conditions of restrictions according to Article 67 and Annex XVII of the Regulation (EC) No 1907/2006 (REACH) for the manufacturing, placing on the market and use must be observed.
Substance is not listed.
Annex XIV of the REACH Regulations (requiring Authorisation for use)
Substance is not listed.
REACH - Pre-registered substances
Substance is listed.
Chemical safety assessment:
A Chemical Safety Assessment has not been carried out
16. OTHER INFORMATION
Safety Data Sheet according to Regulation (EC) No. 1907/2006 (REACH). The above information is believed to be correct but does not purport to be all inclusive and shall be used only as a guide. The information in this document is based on the present state of our knowledge and is applicable to the product with regard to appropriate safety precautions. It does not represent any guarantee of the properties of the product. American Elements shall not be held liable for any damage resulting from handling or from contact with the above product. See reverse side of invoice or packing slip for additional terms and conditions of sale. COPYRIGHT 1997-2016 AMERICAN ELEMENTS. LICENSED GRANTED TO MAKE UNLIMITED PAPER COPIES FOR INTERNAL USE ONLY.
Copper Isotopes
Copper has two stable isotopes, 63Cu and 65Cu.
Nuclide | Isotopic Mass | Half-Life | Mode of Decay | Nuclear Spin | Magnetic Moment | Binding Energy (MeV) | Natural Abundance (% by atom) |
---|---|---|---|---|---|---|---|
52Cu | 51.99718(28)# | N/A | p to 51Ni | (3+)# | N/A | 390.35 | - |
53Cu | 52.98555(28)# | <300 ns | p to 52Ni | (3/2-)# | N/A | 409.61 | - |
54Cu | 53.97671(23)# | <75 ns | p to 53Ni | (3+)# | N/A | 426.07 | - |
55Cu | 54.96605(32)# | 40# ms [>200 ns] | ß+ to 55Ni; p to 54Ni | 3/2-# | N/A | 443.46 | - |
56Cu | 55.95856(15)# | 93(3) ms | ß+ to 56Ni | (4+) | N/A | 459 | - |
57Cu | 56.949211(17) | 196.3(7) ms | ß+ to 57Ni | 3/2- | N/A | 475.46 | - |
58Cu | 57.9445385(17) | 3.204(7) s | ß+ to 58Ni | 1+ | N/A | 488.2 | - |
59Cu | 58.9394980(8) | 81.5(5) s | EC to 59Ni | 3/2- | N/A | 500.93 | - |
60Cu | 59.9373650(18) | 23.7(4) min | EC to 60Ni | 2+ | 1.219 | 510.88 | - |
61Cu | 60.9334578(11) | 3.333(5) h | EC to 61Ni | 3/2- | 2.14 | 522.68 | - |
62Cu | 61.932584(4) | 9.673(8) min | EC to 62Ni | 1+ | -0.38 | 531.69 | - |
63Cu | 62.9295975(6) | STABLE | - | 3/2- | 2.2233 | 542.56 | 69.17 |
64Cu | 63.9297642(6) | 12.700(2) h | EC to 64Ni; ß- to 64Zn | 1+ | -0.217 | 550.64 | - |
65Cu | 64.9277895(7) | STABLE | - | 3/2- | 2.3817 | 560.59 | 30.83 |
66Cu | 65.9288688(7) | 5.120(14) min | ß- to 66Zn | 1+ | -0.282 | 567.73 | - |
67Cu | 66.9277303(13) | 61.83(12) h | ß- to 67Zn | 3/2- | N/A | 576.74 | - |
68Cu | 67.9296109(17) | 31.1(15) s | ß- to 68Zn | 1+ | N/A | 582.96 | - |
69Cu | 68.9294293(15) | 2.85(15) min | ß- to 69Zn | 3/2- | N/A | 591.04 | - |
70Cu | 69.9323923(17) | 44.5(2) s | ß- to 70Zn | (6-) | N/A | 596.32 | - |
71Cu | 70.9326768(16) | 19.4(14) s | ß- to 71Zn | (3/2-) | N/A | 604.4 | - |
72Cu | 71.9358203(15) | 6.6(1) s | ß- to 72Zn | (1+) | N/A | 609.68 | - |
73Cu | 72.936675(4) | 4.2(3) s | ß- to 73Zn; ß- + n to 72Zn | (3/2-) | N/A | 616.83 | - |
74Cu | 73.939875(7) | 1.594(10) s | ß- to 74Zn | (1+,3+) | N/A | 622.11 | - |
75Cu | 74.94190(105) | 1.224(3) s | ß- to 75Zn; ß- + n to 74Zn | (3/2-)# | N/A | 628.33 | - |
76Cu | 75.945275(7) | 641(6) ms | ß- to 76Zn; ß- + n to 75Zn | (3,5) | N/A | 632.68 | - |
77Cu | 76.94785(43)# | 469(8) ms | ß- to 77Zn | 3/2-# | N/A | 638.9 | - |
78Cu | 77.95196(43)# | 342(11) ms | ß- to 78Zn | N/A | N/A | 643.25 | - |
79Cu | 78.95456(54)# | 188(25) ms | ß- + n to 78Zn; ß- to 79Zn | 3/2-# | N/A | 648.53 | - |
80Cu | 79.96087(64)# | 100# ms [>300 ns] | ß- to 80Zn | N/A | N/A | 651.02 | - |