ORDER
Product | Product Code | ORDER | SAFETY DATA | Technical data |
---|---|---|---|---|
(2N) 99% Copper Nanoparticles | CU-M-02-NP | Pricing Add to cart only | SDS > | Data Sheet > |
(3N) 99.9% Copper Nanoparticles | CU-M-03-NP | Pricing Add to cart only | SDS > | Data Sheet > |
(4N) 99.99% Copper Nanoparticles | CU-M-04-NP | Pricing Add to cart only | SDS > | Data Sheet > |
(5N) 99.999% Copper Nanoparticles | CU-M-05-NP | Pricing Add to cart only | SDS > | Data Sheet > |
Copper Nanoparticles Properties (Theoretical)
Molecular Weight | 63.55 |
---|---|
Appearance | Black-Brown |
Melting Point | 1083 °C |
Boiling Point | 2567 °C |
Density | N/A |
Solubility in H2O | N/A |
Poisson's Ratio | 0.34 |
Young's Modulus | 110–128 GPa |
Vickers Hardness | 369 MPa |
Thermal Expansion | (25 °C) 16.5 µm·m-1·K-1 |
True Density | 8.96 g/cm3 |
Bulk Density | 0.15 -0.35 g/cm3 |
Average Particle Size | 25 nm |
Size Range | 2-60 nm |
Specific Surface Area | 30-50 m2/g |
Morphology | Spherical |
Copper Nanoparticles Health & Safety Information
Signal Word | Danger |
---|---|
Hazard Statements | H228-H400 |
Hazard Codes | F |
Risk Codes | 11 |
Safety Statements | 16 |
RTECS Number | GL5325000 |
Transport Information | UN 3089 4.1/PG 2 |
WGK Germany | 3 |
GHS Pictogram |
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About Copper Nanoparticles

Synonyms
Copper OFC, Oxygen-free Copper, Copper OFHC, Oxygen-free high thermal conductivity copper, Copper OFE, Oxygen free electrolytic copper, Oxygen Free Electronic Copper, ASTM F68, Copper Alloy 101, C101, C102, C10100, C10200 Copper O, High-conductivity copper, C-110, C11000, C110 Electrolytic Tough Pitch (ETP) copper, Cu-ETP, C122, C-122, C145, C-145, C147, C-147, O60 (soft / annealed) temper, H00 (cold rolled), H01 (cold rolled, high yield), H02 (half hard) temper, H03 (three quarter hard) temper, H04 (full hard) temper, Copper nanopowder, nanocopper, copper nano-particles
Chemical Identifiers
Linear Formula | Cu |
---|---|
Pubchem CID | 24847820 |
MDL Number | MFCD00010965 |
EC No. | 231-159-6 |
IUPAC Name | N/A |
Beilstein/Reaxys No. | |
SMILES | [Cu] |
InchI Identifier | InChI=1S/Cu |
InchI Key | RYGMFSIKBFXOCR-UHFFFAOYSA-N |
Chemical Formula | |
Molecular Weight | |
Standard InchI | |
Appearance | |
Melting Point | |
Boiling Point | |
Density |
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Packaging Specifications
Typical bulk packaging includes palletized plastic 5 gallon/25 kg. pails, fiber and steel drums to 1 ton super sacks in full container (FCL) or truck load (T/L) quantities. Research and sample quantities and hygroscopic, oxidizing or other air sensitive materials may be packaged under argon or vacuum. Shipping documentation includes a Certificate of Analysis and Safety Data Sheet (SDS). Solutions are packaged in polypropylene, plastic or glass jars up to palletized 440 gallon liquid totes, and 36,000 lb. tanker trucks.
Related Elements
See more Copper products. Copper (atomic symbol: Cu, atomic number: 29) is a Block D, Group 11, Period 4 element with an atomic weight of 63.546. The number of electrons in each of copper's shells is 2, 8, 18, 1 and its electron configuration is [Ar]3d10 4s1. The copper atom has a radius of 128 pm and a Van der Waals radius of 186 pm. Copper was first discovered by Early Man prior to 9000 BC. In its elemental form, copper has a reddish-orange metallic and lustrous appearance. Of all pure metals, only silver
has a higher electrical conductivity. The origin of the word copper comes from the Latin word 'cuprium' which translates as "metal of Cyprus," as the Mediterranean island of Cyprus was known as an ancient source of mined copper.
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